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Synergetix
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Contact Information
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Device Requirements
Device Family:
BGA PGA Lead Leadless Other
Attach device drawings: (including dimensions and tolerances)
Array pitch:
Number of balls, lands, leads, etc:
Size of contacts(balls,lands,leads,etc):
Number of probes for Ground Pad: (if applicable)
Minimal Nominal Maximum(heat dissipation)
Socket Prefrences
Number of sites: Single Multiple
If multiple, please specify how many:
Are component relief cutouts required? Yes No
If yes, please specify:
Are specific board fasteners required? Yes No
If yes, please specify:
Are specific alignment dowels required? Yes No
If yes, please specify:
Is custom engraving required? Yes No
If yes, please specify:
Temperature Requirements
Max Temp (°C): Duration:
Min Temp (°C): Duration:
Electrical Requirements
Max operating frequency (in GHz):
Max current (in amps):
Constant Intermittent
If Intermittent, the cycle time on/off:
Other electrical parameters:
Lid Requirements
Lid Style:
Clamshell Styles
Controlled Travel - Star Handle: Bolt-on Slide-on
Free Travel - 3 Lobe Handle: Bolt-on Slide-on
Other Styles
Clip-on Integral VCC One Piece Bolt-down
Is Heat Dissipation required? Yes No
If yes, how much?
< 20 watts 20 -35 watts > 35 watts
Application
Used with handler Hand Test
If a handler is used, what type?
Is this a new application: New Existing
If new, please attach board layout drawings.
Other Requirements:
Quantity
Socket Prototype: Requested Ship Date:
Socket Production: Requested Ship Date:
Lid Prototype: Requested Ship Date:
Lid Production: Requested Ship Date:

Additional Comments
ALERT! close
The following is a list of things you must complete before moving forward:
IDI